|
|
1. |
RCA 液关键清洗 |
RCA critical clean |
|
2. |
最后步骤 HF 清洗 |
HF last clean |
||
3. |
臭氧去离子水关键清洗 |
Ozone critical clean |
||
4. |
可控 BOE 刻蚀 |
Controlled BOE etch |
||
5. |
光胶剥离(O3/APM 或 SPM/APM) |
Photo resist Stripping(O3/APM 或 SPM/APM) |
||
6. |
聚合物后步刻蚀清洗(FEOL) |
Post Etch(polymer Removal FEOL) |
||
7. |
氮化物刻蚀 |
Nitride Etch |
||
