SUBSTRATE WET PROCESS SYSTEM
所有化学 处理工艺由PLC 程序控制,通过液晶触摸屏进行菜操作,系统按客户要求分为手动/半自动/自动进行操做。
All process recipes are controlled by PLC system with its touch screen. Wet process system can be built as auto/ semi auto/ manually per customer specification.
 
1
半导体基片湿处理工艺及清洗
2
蓝宝石、光学基片湿处理工艺及清洗
3
平板显示器( FPD )湿处理工艺及清洗
4
太阳能电池板湿处理工艺及清洗
 
1
Semiconductor substrate wet process and clean
2
Sapphire/optical substrate wet process and clean
3
FPD wet process and clean
4
Solar cell wafer wet process and clean
   
工艺流程图
 
   
SUBSTRATE CLEAN SYSTEM
SINGLE SUBSTRATES WET PROCESS SYSTEM
 
所有化学处理均由PLC系统程序控制,通过液晶触摸屏进行菜单操作,单/双面化学湿处理。
 
All process recipes are controlled by PLC system with its touch screen, Single/Double sides chemical wet process.
 
   
PARTS CLEAN WET BENCH
CHEMICAL DELIVERY SYSTEM
用于小型钟罩及配件的清洗。
用于基片湿处理设备化学液的循环过滤及输送。
Is used to clean small bell jar and small parts.
CDS is used for chemical filtration/ delivering in the substrates wet process.
 
   
WET BENCH AUTOMATION ROBOT
IPA DRYER
用于基片湿处理过程中基片工艺片架传送。
基于SNA专利技术,用于基片无水迹,无颗粒增加,清洗及取干。
Transferring substrate cassettes during their wet clean process.
Based on SNA patented technology, used for substrates clean and dry with zero particle adding and water mark free.
   
SOLVENT RECOVERY SYSTEM
TUBE/BELL JAR ,QUARTS PARTS CLEAN SYSTEM
用于有机化学液回收、再生。使其电阻率、颗粒、金属离子达到/超过原液的技术指标。
本设备为喷淋、浸泡式清洗机,用于半导体工业炉管/石英管器皿及其管架的清洗,干进/干出。
Used for solvent chemical recovery process to make resistivity particle metal ion meets (or better than) original chemical specification.

This equipment is used to clean quartz tube/bell jar, quartz parts and their paddles by chemical spraying and soaking. Dry In/Dry out.

关于我们 | 广告链接 | 联系我们 | ©2005 上海思恩电子技术有限公司