祛除水迹和颗粒 Eliminates water marks and particles
比其他工艺效率更高（更快更安全） More efficient than comparable methods(quicker dry and much safer)
适用于所有薄型基片 Good for all kinds of thinner substrates
无运动组件 No moving parts at all
可控温度及雾化量 Controllable vapor temperature and pressure
低消耗化学液 Less chemical usage
无碎片事件（有效代替传统甩干机） No fragments (replace traditional dryer efficiently)
